Thermal conductive potting glue is a one-to-one ratio two-component electronic sealing fluid with a thermal conductivity of 0.6-3.5W/M.K. It does not corrode electronic components and can bond steel, aluminum, copper, tin, rubber, plastic, wood, etc. After curing, it will not flow out from the construction site regardless of hot or cold temperatures. This potting material protects electronic components and circuits from vibration damage.

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Features: Thermal conductivity: fluid glue 0.6~3.5W/m.K, electronic insulation thermal conductive sealant.

Applications: Electric vehicle (EV) batteries, 5G, autonomous driving systems, mobile phones, AIOT, HPC (high performance computing), servers, ICs, CPUs, MOS, LEDs, motherboards, power supplies, micro-inverters, LCD TVs, notebooks, PCs, telecommunications equipment, battery energy storage systems, wireless hubs, DDR ll modules, electromechanical drive systems.